Functional Materials

JHC's conductive adhesive film is a solder substitution technology that has excellent heat resistance, moisture resistance, adhesion and workability.

ticf-600

It is an isotropic conductive film which is excellent in heat resistance by applying polyamide resin, and is able to replace CBF product.

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ldi-7300

DuPont™ Riston® LDI7300 PHOTOPOLYMER FILM is a negative working, aqueous processable dry film photo-resist suitable for 355nm UV-LASER Direct imaging.

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esf-210

OSP resistance and chemical resistance are realized by using silver and copper composite metal. It is excellent in heat resistance and moisture resistance.

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esf-240

OSP resistance and chemical resistance are realized by using silver and copper composite metal. It is excellent in heat resistance and moisture resistance.

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