ESF-210

ESF-210 is a shielding film that realizes OSP resistance and chemical resistance. It uses silver and copper composite metal, and has excellent heat resistance and moisture resistance.

ESF-210

Thin EMI Shielding Sheet for Electronic Components

ESF-210 is a shielding film that realizes OSP resistance and chemical resistance. It uses silver and copper composite metal, and has excellent heat resistance and moisture resistance.

Feature

  • Achieve excellent OSP and chemical resistance
  • Using Ag-Cu composite metal for shield material
  • Shielding property and Flexibility are the same or better than other products

Structure

Specification

Thickness (㎛)20±2
Surface Resistance (Ω/□)Max. 0.50
Bonding Resistance (Ω/5cm)Max. 8
Resistance(Before Reflow) (Ω/5cm)Min. 2.0
Resistance(After Reflow) (Ω/5cm)Min. 3.0

1) Test condition : 160℃*1.5bar*30min

Storage

Room temperature storage (5~10℃ / RH 20%)

Application Examples

  • Smartphone or Tablet PC FPC