TICF-600

TICF-600 is an isotropic conductive film with excellent heat resistance by applying polyamide resin.

TICF-600

Electrically Conductive Bonding Sheet for Electronic Components

TICF-600 is an isotropic conductive film with excellent heat resistance by applying polyamide resin.

Feature

  • Strengthen GND by electrically connecting GND circuit of FPC and metal reinforcing plate
  • After attaching reinforcing plate to FPC, it is possible to mount parts by Pb Free Solder Reflow.
  • Excellent adhesion with SUS, FR-4, PI and other reinforcing plates
  • Achieves stable conductivity due to adoption of Ag-Cu metal filler

Structure

Specification

Thickness (㎛)60±5
Surface Resistance (Ω/□)Max. 0.30
Linear Resistance (Ω/5cm)Max. 1.5
Pre-Bonding Strength1) (Kgf/cm)Min. 0.2
Main Bonding Strength2) (Kgf/cm)Min. 1.0

1) Test condition : 120℃*2bar*10sec
2) Test condition : 150℃*3Mpa, 30min

Storage

Room temperature storage (5~10℃ / RH 20%)

Application Examples

  • Camera module(smart phones, tablet PCs, etc.), LCD module
  • Camera module
  • Cross-sectional structure